8

1

2

3

4

9

6

5

7

11

10

12

1

2

3

A

B

C

D

TS3DS26227

www.ti.com

SCDS224B – JUNE 2008 – REVISED OCTOBER 2010

HIGH-BANDWIDTH DUAL SPDT DIFFERENTIAL SIGNAL SWITCH

WITH INPUT LOGIC TRANSLATION

Check for Samples: TS3DS26227

1

FEATURES

APPLICATIONS

•

Cell Phones

2

•

High-Bandwidth Data Paths – Up to 800 MHz

•

PDAs

•

Specified Break-Before-Make Switching

•

Portable Instrumentation

•

•

Low-Voltage Differential Signal Routing

•

Low Charge Injection

•

Mobile Industry Processor Interface (MIPI)

•

Excellent ON-State Resistance Matching

Signal Routing

•

Low Total Harmonic Distortion (THD)

YZT PACKAGE

•

(BOTTOM VIEW)

•

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

ESD Performance Tested Per JESD 22

–

4000-V Human-Body Model

(A114-B, Class II)

–

1000-V Charged-Device Model (C101)

Table 1. TERMINAL ASSIGNMENTS

–

200-V Machine Model (A115-A)

A

B

C

D

1

IN1

NO1

COM1

NC1

2

GND

GND

3

IN2

NO2

COM2

NC2

DESCRIPTION/ORDERING INFORMATION

The TS3DS26227 is a dual single-pole double-throw (SPDT) analog switch that is designed to operate from

2.3 V to 3.6 V. The device offers high-bandwidth data paths, and a break-before-make feature to prevent signal

distortion during the transferring of a signal from one path to another. The device has excellent total harmonic

distortion (THD) performance and consumes very low power. These features make this device suitable for

portable applications.

control circuitry, which allows the TS3DS26227 to be controlled by 1.8-V signals.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

–40°C to 85°C

Tape and reel

TS3DS26227YZTR

0.23-mm Large Bump – YZT (Pb-free)

(1)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(3)

YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2008–2010, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.