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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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SM6T200A 데이터시트(PDF) 2 Page - General Semiconductor |
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SM6T200A 데이터시트(HTML) 2 Page - General Semiconductor |
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2 / 3 page  ELECTRICAL CHARACTERISTICS RATINGS at (TA=25ºC unless otherwise noted) SM6T6V8A KE7 KE7 5.80 1000 6.45 7.14 10 10.5 57.0 13.4 298 5.7 SM6T7V5A KK7 AK7 6.40 500 7.13 7.88 10 11.3 53.0 14.5 276 6.1 SM6T10A KT7 AT7 8.55 10.0 9.50 10.5 1.0 14.5 41.0 18.6 215 7.3 SM6T12A KX7 AX7 10.2 5.00 11.4 12.6 1.0 16.7 36.0 21.7 184 7.8 SM6T15A LG7 LG7 12.8 1.00 14.3 15.8 1.0 21.2 28.0 27.2 147 8.4 SM6T18A LM7 BM7 15.3 1.00 17.1 18.9 1.0 25.2 24 32.5 123 8.8 SM6T22A LT7 BT7 18.8 1.00 20.9 23.1 1.0 30.6 20.0 39.3 102 9.2 SM6T24A LV7 LV7 20.5 1.00 22.8 25.2 1.0 33.2 18.0 42.8 93 9.4 SM6T27A LX7 BX7 23.1 1.00 25.7 28.4 1.0 37.5 16.0 48.3 83 9.6 SM6T30A ME7 CE7 25.6 1.00 28.5 31.5 1.0 41.5 14.5 53.5 75 9.7 SM6T33A MG7 MG7 28.2 1.00 31.4 34.7 1.0 45.7 13.1 59.0 68 9.8 SM6T36A MK7 CK7 30.8 1.00 34.2 37.8 1.0 49.9 12.0 64.3 62 9.9 SM6T39A MM7 CM7 33.3 1.00 37.1 41.0 1.0 53.9 11.1 69.7 57 10.0 SM6T68A NG7 NG7 58.1 1.00 64.6 71.4 1.0 92.0 6.50 121 33 10.4 SM6T100A NV7 NV7 85.5 1.00 95.0 105 1.0 137 4.40 178 22.5 10.6 SM6T150A PK7 PK7 128 1.00 143 158 1.0 207 2.90 265 15 10.8 SM6T200A PR7 PR7 171 1.00 190 210 1.0 274 2.20 353 11.3 10.8 SM6T220A PR8 PR8 188 1.00 209 231 1.0 328 2.00 388 10.3 10.8 NOTES: (1) For bi-directional devices add “C” for ±10% and “CA” for ±5% tolerance of VBR (2) VBR measured after IT applied for 300µs square wave pulse (3) For bipolar devices with VR=10 Volts or under, the IT limit is doubled APPLICATION NOTES A 600W (SMB) device is normally selected when the threat of transients is from lightning induced transients, conducted via external leads or I/O lines. It is also used to pro- tect against switching transients induced by large coils or industrial motors. Source impedance at component level in a system is usually high enough to limit the current within the peak pulse current (IPP) rating of this series. In an overstress condition, the failure mode is a short circuit. RECOMMENDED PAD SIZES The pad dimensions should be 0.010” (0.25mm) longer than the contact size, in the lead axis. This allows a solder fillet to form, see figure below. Contact factory for soldering methods. 0.90 (2.28) 0.025 (2.16) 0.070 (1.78) Type(1) Device Marking Code Uni Bi Standoff Voltage VRM (Volts) Leakage Current(3) IRM @ VRM ( µA) Breakdown Voltage VBR @ IT (2) (Volts) Min Max Test Current IT (mA) Clamping Voltage VC @ IPP 10/1000 µs (Volts) (Amps) α T Max 10-4/ °C Clamping Voltage VC @ IPP 8/20 µs (Volts) (Amps) |
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유사한 설명 - SM6T200A |
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