전자부품 데이터시트 검색엔진 |
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HCPL-261A 데이터시트(PDF) 6 Page - Agilent(Hewlett-Packard) |
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HCPL-261A 데이터시트(HTML) 6 Page - Agilent(Hewlett-Packard) |
6 / 20 page 6 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) Solder Reflow Temperature Profile 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160°C 140°C 150°C PEAK TEMP. 245°C PEAK TEMP. 240°C PEAK TEMP. 230°C SOLDERING TIME 200°C PREHEATING TIME 150°C, 90 + 30 SEC. 2.5°C ± 0.5°C/SEC. 3°C + 1°C/–0.5°C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3°C + 1°C/–0.5°C/SEC. REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. 1.00 ± 0.15 (0.039 ± 0.006) 7° NOM. 12.30 ± 0.30 (0.484 ± 0.012) 0.75 ± 0.25 (0.030 ± 0.010) 11.00 (0.433) 5 6 7 8 4 3 2 1 11.15 ± 0.15 (0.442 ± 0.006) 9.00 ± 0.15 (0.354 ± 0.006) 1.3 (0.051) 13.56 (0.534) 2.29 (0.09) LAND PATTERN RECOMMENDATION 1.78 ± 0.15 (0.070 ± 0.006) 4.00 (0.158) MAX. 1.55 (0.061) MAX. 2.54 (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 0.254 + 0.076 - 0.0051 (0.010 + 0.003) - 0.002) MAX. |
유사한 부품 번호 - HCPL-261A |
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유사한 설명 - HCPL-261A |
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