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FAN5640S7X 데이터시트(PDF) 3 Page - Fairchild Semiconductor |
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FAN5640S7X 데이터시트(HTML) 3 Page - Fairchild Semiconductor |
3 / 11 page © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5640 • Rev. 1.0.2 3 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VEN Enable Voltage -0.3 6.0 V VIN, VIOUT1, VIOUT2 -0.3 22.0 V IRSET Current Sourced by RSET 120 A TJ Junction Temperature -40 150 °C TSTG Storage Temperature -65 150 °C TL Lead Soldering Temperature, 10 Seconds 260 °C ESD Electrostatic Discharge Protection Level Human Body Model 2 kV Charged Device Model 2 Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol Parameter Min. Typ. Max. Unit VIN Supply Voltage 6 20 V VEN Enable Voltage 5.5 V IOUT1, IOUT2 Output Current Range Through Each String 2.5 25.0 mA TA Operating Ambient Temperature Range (1) -40 +85 °C TJ Operating Junction Temperature Range (1) -40 +125 °C Thermal Properties Symbol Parameter Min. Typ. Max. Unit ΘJA Junction to Ambient Thermal Resistance (1) 300 °C/W Note: 1. Junction-to-Ambient thermal resistance is a function of application and board layout. This data is measured with four-layer, 1s2p boards in accordance with JESD51- JEDEC standard. Special attention must be paid not to exceed the maximum junction temperature. |
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