IRF6612PbF

www.irf.com

7

Fig 17. Diode Reverse Recovery Test Circuit for N-Channel

P.W.

Period

di/dt

Diode Recovery

dv/dt

Ripple

≤ 5%

Body Diode

Forward Drop

Re-Applied

Voltage

Reverse

Recovery

Current

Body Diode Forward

Current

Driver Gate Drive

Inductor Curent

D =

P.W.

Period

*

Inductor Current

Circuit Layout Considerations

• Low Stray Inductance

• Ground Plane

• Low Leakage Inductance

Current Transformer

• Driver same type as D.U.T.

• D.U.T. - Device Under Test

+

-

+

+

+

-

-

-

D.U.T

DirectFET™ Substrate and PCB Layout, MX Outline

(Medium Size Can, X-Designation).

Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET.

This includes all recommendations for stencil and substrate designs.

G = GATE

D = DRAIN

S = SOURCE

D

D

D

D

G

S

S