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CD40105BMS

Chip Dimensions and Pad Layout

FIGURE 11. EXPANSION, 8-BITS-WIDE-BY-16 N-BITS LONG USING CD40105BMS

SI

D0

D1

D2

D3

Q0

Q1

Q2

Q3

DIR

MR

SO

DOR

SI

D0

D1

D2

D3

Q0

Q1

Q2

Q3

DIR

MR

SO

DOR

SI

D0

D1

D2

D3

Q0

Q1

Q2

Q3

DIR

MR

SO

DOR

SI

D0

D1

D2

D3

Q0

Q1

Q2

Q3

DIR

MR

SO

DOR

SHIFT

IN

DATA OUT

READY

8 BIT

DATA

8 BIT

DATA

SHIFT

OUT

DATA IN

READY

RESET

Dimensions in parenthesis are in millimeters and are derived from the basic

inch dimensions as indicated. Grid graduations are in mils (10-3 inch).

METALLIZATION:

Thickness: 11k

Å

PASSIVATION:

10.4kÅ - 15.6k

BOND PADS:

0.004 inches X 0.004 inches MIN

DIE THICKNESS:

0.0198 inches - 0.0218 inches