전자부품 데이터시트 검색엔진 |
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CD4072 데이터시트(PDF) 10 Page - Intersil Corporation |
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CD4072 데이터시트(HTML) 10 Page - Intersil Corporation |
10 / 10 page 453 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com CD4071BMS, CD4072BMS, CD4075BMS Chip Dimensions and Pad Layouts CD4071BMS CD4072BMS CD4075BMS Dimensions in parentheses are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch) METALLIZATION: Thickness: 11k Å − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches |
유사한 부품 번호 - CD4072 |
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유사한 설명 - CD4072 |
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