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MTB110P10J3 데이터시트(PDF) 2 Page - Cystech Electonics Corp. |
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MTB110P10J3 데이터시트(HTML) 2 Page - Cystech Electonics Corp. |
2 / 9 page CYStech Electronics Corp. Spec. No. : C968J3 Issued Date : 2014.08.07 Revised Date : Page No. : 2/9 MTB110P10J3 CYStek Product Specification Absolute Maximum Ratings (TC=25C, unless otherwise noted) Parameter Symbol Limits Unit Drain-Source Voltage VDS -100 V Gate-Source Voltage VGS ±20 Continuous Drain Current @ TJ=175C, TC=25C, VGS=10V (Note 1) ID -14 A Continuous Drain Current @ TJ=175C,TC=100C, VGS=10V (Note 1) -10 Continuous Drain Current @TA=25C, VGS=10V (Note 2) IDSM -3.3 Continuous Drain Current @TA=70C, VGS=10V (Note 2) -2.6 Pulsed Drain Current (Note 3) IDM -56 Avalanche Current (Note 3) IAS -35 Avalanche Energy @ L=0.1mH, ID=-35A, RG=25Ω (Note 2) EAS 61 mJ Total Power Dissipation TC=25C (Note 1) PD 50 W TC=100C (Note 1) 25 TA=25C (Note 2) PDSM 2.5 TA=70C (Note 2) 1.6 Operating Junction and Storage Temperature Range Tj, Tstg -55~+175 C Thermal Data Parameter Symbol Typical Maximum Unit Thermal Resistance, Junction-to-case RθJC 2.7 3 C/W Thermal Resistance, Junction-to-ambient, t≤10s (Note 2) RθJA 15 18 Thermal Resistance, Junction-to-ambient, steady state 40 50 Note : 1 .The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. 2 . The value of RθJA is measured with the device mounted on 1 in²FR-4 board with 2 oz. copper, in a still air environment with TA=25°C. The power dissipation PDSM is based on RθJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on the user’s specific board design. 3 . Pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and low duty cycles to keep initial TJ=25°C. |
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