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KIA7425P 데이터시트(PDF) 4 Page - KEC(Korea Electronics)

부품명 KIA7425P
상세설명  BIPOLAR LINEAR INTEGRATED CIRCUIT
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KIA7425P 데이터시트(HTML) 4 Page - KEC(Korea Electronics)

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1999. 11. 25
4/4
KIA7419P/F~KIA7445P/F
Revision No : 2
PRECAUTION FOR USE
SOLDERING
Flat Package (SOT-89 Package)
Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for
components are all the more expanding in varieties. Especially, surface mounting is steadily penetrating into industrial
segments as a world-wide popular technical trend. Although exposure to high temperature is inevitable during soldering
we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent excellent
reliability.
(a) When employing solder reflow method
① Atmospheric temperature around resin surfaces must be less than 240℃, not exceeding the time length of 10 sec.
② Recommend temperature profile
③ Precautions on heating method
When resin in kept exposed to high temperature for a long time, device reliability may be marred.
Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising.
(b) When employing halogen lamps or infrared-ray heaters
When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces ;
such devices cause extensive localized temperature rise.
※ Please keep a reflow solder operating when SOT-89 package’s soldering.
60 sec.
Time (sec.)
Within 30 sec.
Within 10 sec.
Fig 6
150
210
240


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