TS5A22364

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SCDS261G – MARCH 2008 – REVISED SEPTEMBER 2015

6.4 Thermal Information

TS5A22364

DGS (VSSOP)

DRC (VSON)

YZP (DSBGA)

UNIT

10 PINS

10 PINS

10 PINS

Junction-to-ambient thermal resistance

163.3

44.3

90.9

°C/W

Junction-to-case (top) thermal resistance

56.4

70.1

0.3

°C/W

Junction-to-board thermal resistance

83.1

19.3

8.3

°C/W

Junction-to-top characterization parameter

6.8

2.0

3.2

°C/W

Junction-to-board characterization parameter

81.8

19.4

8.3

°C/W

Junction-to-case (bottom) thermal resistance

N/A

6.2

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics for 2.5-V Supply

(1)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ANALOG SWITCH

Analog signal

V

range

25°C

0.65

0.94

ON-state

COM to NO or NC,

2.7 V

Ω

resistance

see Figure 13

Full

1.3

ON-state

25°C

0.023

0.11

COM to NO or NC,

resistance match

2.7 V

Ω

see Figure 13

Full

0.15

between channels

ON-state

25°C

0.18

0.46

COM to NO or NC,

resistance

2.7 V

Ω

see Figure 13

Full

0.5

flatness

Shunt switch

Full

2.7 V

25

50

Ω

resistance

COM

25°C

–50

50

ON leakage

See Figure 15

2.7 V

nA

Full

–375

375

current

Input logic high

1.4

5.5

Full

V

Input logic low

0.6

25°C

–250

250

Input leakage

2.7 V

nA

current

Full

–250

250

(1)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum

(2)

excessive current consumption. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.

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