LM2936

SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

Input voltage (survival)

−50

60

V

Internally limited

150

°C

−65

150

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its specified operating ratings.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

the LM2936 may go into thermal shutdown.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. .

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

−40

125

°C

5.5

40

V

5.5

60

V

0

40

V

6.4 Thermal Information

LM2936

SOIC (D)

TO-252

VSSOP

SOT-223

TO-92 (LP)

UNIT

(NDP)

(DGK)

(DCY)

8 PINS

3 PINS

8 PINS

4 PINS

3 PINS

Junction-to-ambient thermal resistance

111.4

50.5

173.4

62.8

156.8

Junction-to-case (top) thermal resistance

56.3

52.6

65.9

44.2

80.4

Junction-to-board thermal resistance

51.9

29.7

94.9

11.7

n/a

°C/W

Junction-to-top characterization parameter

10.9

4.8

9.6

3.6

24.5

Junction-to-board characterization parameter

51.4

29.3

93.3

11.6

136.0

Junction-to-case (bottom) thermal resistance

n/a

1.6

n/a

n/a

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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