NXP Semiconductors

BTA2008-1000D

3Q Hi-Com Triac

BTA2008-1000D

All information provided in this document is subject to legal disclaimers.

© NXP Semiconductors N.V. 2014. All rights reserved

Product data sheet

11 June 2014

10 / 13

11. Package outline

UNIT

A

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

5.2

5.0

b

0.48

0.40

c

0.45

0.38

D

4.8

4.4

d

1.7

1.4

E

4.2

3.6

L

14.5

12.7

e

2.54

e1

1.27

max.

2.5

b1

0.66

0.55

DIMENSIONS (mm are the original dimensions)

Note

1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.

SOT54

TO-92

SC-43A

04-06-28

04-11-16

A

L

0

2.5

5 mm

scale

b

c

D

L1

d

E

Plastic single-ended leaded (through hole) package; 3 leads

SOT54

e1

e

1

2

3

Fig. 12. Package outline TO-92 (SOT54)