LM3150

SNVS561F – SEPTEMBER 2008 – REVISED DECEMBER 2014

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN, RON to GND

–0.3

47

V

SW to GND

–3

47

V

BST to SW

–0.3

7

V

BST to GND

–0.3

52

V

All Other Inputs to GND

–0.3

7

V

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Ratings. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Ratings

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

6

42

V

−40

125

°C

EN

0

5

V

7.4 Thermal Information

LM3150

PWP

UNIT

14 PINS

Junction-to-ambient thermal resistance

42.5

Junction-to-case (top) thermal resistance

28.7

Junction-to-board thermal resistance

24.2

°C/W

Junction-to-top characterization parameter

0.9

Junction-to-board characterization parameter

23.9

Junction-to-case (bottom) thermal resistance

4.4

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

Submit Documentation Feedback

Copyright © 2008–2014, Texas Instruments Incorporated

Product Folder Links: LM3150