LC75839PW

No.A1953-2/27

Specifications

Absolute Maximum Ratings at Ta = 25

°C, VSS = 0V

Parameter

Symbol

Conditions

Ratings

Unit

Maximum supply voltage

VDD max

VDD

-0.3 to +6.5

V

VIN1

CE, CL, DI, INH

-0.3 to +6.5

Input voltage

VIN2

OSCI, VDD1, VDD2

-0.3 to VDD+0.3

V

Output voltage

VOUT

S1 to S53, COM1 to COM4, P1 to P4

-0.3 to VDD+0.3

V

IOUT1

S1 to S52

300

μA

IOUT2

COM1 to COM4, S53

3

Output current

IOUT3

P1 to P4

5

mA

Allowable power dissipation

Pd max

Ta=85

°C

200

mW

Operating temperature

Topr

-40 to +85

°C

Storage temperature

Tstg

-55 to +125

°C

Allowable Operating Ranges at Ta = -40 to +85

°C, VSS = 0V

Ratings

Parameter

Symbol

Conditions

min

typ

max

Unit

Supply voltage

VDD

VDD

4.5

6.0

V

VDD1

VDD1

2/3VDD

VDD

Input voltage

VDD2

VDD2

1/3VDD

VDD

V

VIH1

CE, CL, DI, INH

0.4VDD

6.0

Input high-level voltage

VIH2

OSCI: External clock operating mode

0.4VDD

VDD

V

VIL1

CE, CL, DI, INH

0

0.2VDD

Input low-level voltage

VIL2

OSCI: External clock operating mode

0

0.2VDD

V

External clock operating frequency

fCK

OSCI: External clock operating mode [Figure 4]

10

300

600

kHz

External clock duty cycle

DCK

OSCI: External clock operating mode [Figure 4]

30

50

70

%

Data setup time

tds

CL, DI

[Figure 2][Figure 3]

160

ns

Data hold time

tdh

CL, DI

[Figure 2][Figure 3]

160

ns

CE wait time

tcp

CE, CL

[Figure 2][Figure 3]

160

ns

CE setup time

tcs

CE, CL

[Figure 2][Figure 3]

160

ns

CE hold time

tch

CE, CL

[Figure 2][Figure 3]

160

ns

High-level clock pulse width

t

CL

[Figure 2][Figure 3]

160

ns

Low-level clock pulse width

t

CL

[Figure 2][Figure 3]

160

ns

Rise time

tr

CE, CL, DI

[Figure 2][Figure 3]

160

ns

Fall time

tf

CE, CL, DI

[Figure 2][Figure 3]

160

ns

INH switching time

tc

INH, CE

[Figure 5][Figure 6]

10

μs

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating

Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.