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LC898212XD 데이터시트(PDF) 4 Page - ON Semiconductor

부품명 LC898212XD
상세설명  AF Controller
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제조업체  ONSEMI [ON Semiconductor]
홈페이지  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

LC898212XD 데이터시트(HTML) 4 Page - ON Semiconductor

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LC898212XD
PS No.A2242-4/4
Package Dimensions
WLP12J(1.77X1.37)
unit : mm
ORDERING INFORMATION
Device
Package
Shipping (Qty / Packing)
LC898212XD-SH
WLP12J(1.77X1.37)
(Pb-Free / Halogen Free)
5000 / Tape & Reel
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number
of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at
www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no
warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the
application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual
performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical
experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use
as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in
which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for
any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or
death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture ofthe
part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
WLCSP12, 1.77x1.37
CASE 567GH
ISSUE O
SEATING
PLANE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
2X
DIM
A
MIN
MAX
−−−
MILLIMETERS
A1
D
1.77 BSC
E
b
0.15
0.25
e
0.40 BSC
0.33
D
E
A
B
PIN A1
REFERENCE
e
A
0.05
B
C
0.03 C
0.08 C
12X
b
4
C
B
A
0.13 C
A1
A2
C
0.03
0.13
1.37 BSC
0.25
12X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.40
0.10 C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
A2
0.20 REF
RECOMMENDED
A1
PACKAGE
OUTLINE
12
3
PITCH
0.40
PITCH
A
e/2
e


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