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LM26CIM5-RPA 데이터시트(PDF) 4 Page - Texas Instruments

부품명 LM26CIM5-RPA
상세설명  Accurate, Factory-Preset Thermostat
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홈페이지  http://www.ti.com
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LM26
SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015
www.ti.com
6 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
(Top View)
Pin Functions
PIN
TYPE
DESCRIPTION
NO.
NAME
1
HYST
Input
Hysteresis control, digital input; connect to GND for 10°C or V+ for 2°C
Power
Ground, connected to the back side of the die through lead frame; connect to
2
GND
system ground
Output
Analog output voltage proportional to temperature; leave floating or connect to a
3
VTEMP
high impedance node.
4
V+
Power
Supply input; connect to 2.7 V to 5.5 V with a 0.1-
μF bypass capacitor.
Output
Overtemperature Shutdown open-drain active low thermostat digital output;
OS
connect to controller interrupt, system/power supply shutdown; pullup resistor
≥ 10
k
Ω
OS
Output
Overtemperature Shutdown push-pull active high thermostat digital output;
connect to controller interrupt, system/power supply shutdown
5(1)
US
Output
Undertemperature Shutdown open-drain active low thermostat digital output;
connect to controller interrupt, system/power supply shutdown; pullup resistor
≥ 10
k
Ω
US
Output
Undertemperature Shutdown push-pull active high thermostat digital output;
connect to controller interrupt, system/power supply shutdown
(1)
Pin 5 functionality and trip point setting are programmed during LM26 manufacture.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Input Voltage
6
V
Input Current at any pin (2)
5
mA
Package Input Current (2)
20
mA
Package Dissipation at TA = 25°C
(3)
500
mW
Vapor Phase (60 seconds)
215
Soldering
SOT-23 Package
°C
Information(4)
Infrared (15 seconds)
220
Storage Temperature, Tstg
−65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V
+), the current at that pin should be limited to 5 mA.
The 20-mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input
current of 5 mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5 mA each.
(3)
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX (maximum junction temperature),
θJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PD = (TJMAX–TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJMAX
= 150°C. For this device the typical thermal resistance (
θJA) of the different package types when board mounted follow:
(4)
See the URL http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.
4
Submit Documentation Feedback
Copyright © 2001–2015, Texas Instruments Incorporated
Product Folder Links: LM26


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