© 2011 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN3240 • Rev. 1.0.2

2

Ordering Information

Part

Number

Minimum Input

Time

Maximum Pulse

Width

Package

Packing

Method

Reel

Quantity

FAN3240TMX

15 ms

150 ms

SOIC-8

Tape & Reel

2,500

FAN3241TMX

1 ms

30 ms

SOIC-8

Tape & Reel

2,500

All standard Fairchild Semiconductor products are RoHS compliant and many are also “GREEN” or going green. For Fairchild’s

Package Outline

2

3

8

6

1

4

7

5

EN

5VB

IN1

IN2

VS

OUT1

GND

OUT2

Figure 2.

SOIC-8 (Top View)

Thermal Characteristics

(1)

Package

Θ

JL

(2)

Θ

JT

(3)

Θ

JA

(4)

Ψ

JB

(5)

Ψ

JT

(6)

Unit

8-Pin, Small-Outline Integrated Circuit (SOIC)

40

31

89

43

3.0

°C/W

Notes:

1.

Estimates derived from thermal simulation; actual values depend on the application.

2.

Theta_JL (

Θ

thermal pad) that are typically soldered to a PCB.

3.

Theta_JT (

Θ

held at a uniform temperature by a top-side heatsink.

4.

The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and

JESD51-7, as appropriate.

5.

Psi_JB (

Ψ

application circuit board reference point for the thermal environment defined in Note 4. For the MLP-8 package, the board

reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the

SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.

6.

Psi_JT (

Ψ

the center of the top of the package for the thermal environment defined in Note 4.