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TPA6133A2 데이터시트(PDF) 4 Page - Texas Instruments |
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4 / 26 page TPA6133A2 SLOS821B – JUNE 2013 – REVISED SEPTEMBER 2014 www.ti.com 7 Specification 7.1 Absolute Maximum Ratings (1) over operating free-air temperature range, TA = 25°C (unless otherwise noted) MIN MAX UNIT Supply voltage, VDD –0.3 6 V CPVSS-0.2 V to minimum of RIGHTINx, LEFTINx (3.6 V, VDD+0.2 V) Input voltage SD, TEST1, TEST2 –0.3 7 V Output continuous total power dissipation See the Thermal Information Table Operating free-air temperature range, TA –40 85 °C Operating junction temperature range, TJ –40 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all –3 3 kV pins(1) V(ESD) Electrostatic discharge Charged device model (CDM), per JEDEC specification –750 750 V JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN MAX UNIT Supply voltage, VDD 2.5 5.5 V VIH High-level input voltage TEST1, TEST2, SD 1.3 V VIL Low-level input voltage SD 0.35 V Minimum Load Impedance 12.8 Ω TA Operating free-air temperature –40 85 °C 7.4 Thermal Information RTJ THERMAL METRIC(1) UNIT 20 PINS RθJA Junction-to-ambient thermal resistance 34.8 RθJC(top) Junction-to-case (top) thermal resistance 32.5 RθJB Junction-to-board thermal resistance 11.6 °C/W ψJT Junction-to-top characterization parameter 0.4 ψJB Junction-to-board characterization parameter 11.6 RθJC(bot) Junction-to-case (bottom) thermal resistance 3.1 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: TPA6133A2 |
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