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DLP3000FQB 데이터시트(PDF) 7 Page - Texas Instruments

부품명 DLP3000FQB
상세설명  짰 0.3 WVGA Series
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DLP3000
www.ti.com
DLPS022B – JANUARY 2012 – REVISED MARCH 2015
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted).
(1)
MIN
MAX
UNIT
SUPPLY VOLTAGES
VCC
Voltage applied to VCC
(2)
–0.5
4
V
VREF
Voltage applied to VREF
(2)
–0.5
4
V
VOFFSET
Voltage applied to VOFFSET
(2) (3) (4)
–0.5
8.75
V
VBIAS
Voltage applied to VBIAS
(2) (4)
–0.5
17
V
VRESET
Voltage applied to VRESET
(2)
–11
0.5
V
|VBIAS – VOFFSET|
Supply voltage delta (absolute value) (4)
8.75
V
INPUT VOLTAGES
Voltage applied to all other input pins(2)
–0.5
VREF + 0.3
V
IOH
Current required from a high-level output, VOH = 2.4 V
–20
mA
IOL
Current required from a low-level output, VOL = 0.4 V
15
mA
ENVIRONMENTAL
Case temperature - operational (5) (6)
–20
90
ºC
TCASE
Case temperature - non–operational (6)
–40
90
ºC
Absolute temperature delta between any point on the window, ceramic,
| TDELTA |
15
°C
or array - operational(7) (8)
TDP
Dew Point (operational and non-operational)
81
ºC
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device is not implied at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure above Recommended Operating Conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to the ground terminals VSS (ground). The following power supplies are all required to operate the
DMD: Voltages VSS, VCC, VREF, VOFFSET, VBIAS, and VRESET.
(3)
VOFFSET supply transients must fall within specified voltages.
(4)
To prevent excess current, the supply voltage delta |VBIAS - VOFFSET| must be less than specified limit.
(5)
Exposure of the DMD simultaneously to any combination of the maximum operating conditions for case temperature, differential
temperature, or illumination power density will reduce the device lifetime.
(6)
DMD Temperature is the worst-case of any test point shown in Figure 11, or the active array as calculated by the Micromirror Array
Temperature Calculation.
(7)
Ceramic package temperature as measured at test point 3 (TP 3) in Figure 11.
(8)
As measured between any two points on the exterior of the package, or as predicted between any two points inside the micromirror
array cavity. Refer to the Micromirror Array Temperature Calculation for information related to calculating the micromirror array
temperature.
6.2 Storage Conditions
applicable before the DMD is installed in the final product
MIN
MAX
UNIT
Tstg
DMD Storage Temperature
–40
85
°C
Storage Dew Point - long-term (1)
24
°C
TDP
Storage Dew Point - short-term (2)
28
°C
(1)
Long-term is defined as the usable life of the device.
(2)
Dew points beyond the specified long-term dew point are for short-term conditions only, where short-term is defined as less than 60
cumulative days over the usable life of the device (operating, non-operating, or storage).
6.3 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
Copyright © 2012–2015, Texas Instruments Incorporated
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