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DLP7000FLP 데이터시트(PDF) 11 Page - Texas Instruments

부품명 DLP7000FLP
상세설명  LVDS Type A DMD
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DLP7000
www.ti.com
DLPS026D – AUGUST 2012 – REVISED NOVEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
ELECTRICAL
VCC
Voltage applied to VCC
(2) (3)
–0.5
4
V
VCCI
Voltage applied to VCCI
(2) (3)
–0.5
4
V
VCC2
Voltage applied to VVCC2
(2) (3) (4)
–0.5
8
V
Micromirror Clocking Pulse Waveform Voltage applied to MBRST[15:0]
VMBRST
–28
28
V
Input Pins (supplied by DLPA200)
|VCC – VCCI|
Supply voltage delta (absolute value) (4)
0.3
V
Voltage applied to all other input pins(2)
–0.5
VCC + 0.3
V
Maximum differential voltage, Damage can occur to internal termination
|VID|
700
mV
resistor if exceeded, See Figure 3
Current required from a high-level
IOH
VOH = 2.4 V
–20
mA
output
Current required from a low-level
IOL
VOL = 0.4 V
15
mA
output
ENVIRONMENTAL
Case temperature: operational(5)
10
65
°C
TC
Case temperature: non-operational(5)
–40
80
°C
TGRADIENT
Device temperature gradient - operational(6)
10
°C
Operating relative humidity (non-condensing)
0
95
%RH
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages referenced to VSS (ground).
(3)
VOFFSET supply transients must fall within specified max voltages.
(4)
To prevent excess current, the supply voltage delta |VCC – VCCI| must be less than specified limit.
(5)
DMD Temperature is the worst-case of any test point shown in Figure 18, or the active array as calculated by the Micromirror Array
Temperature Calculation.
(6)
As measured between any two points on the exterior of the package, or as predicted between any two points inside the micromirror
array cavity. Refer to Thermal Information and Micromirror Array Temperature Calculation.
7.2 Storage Conditions
applicable before the DMD is installed in the final product
MIN
MAX
UNIT
Storage temperature
–40
80
°C
Tstg
Storage humidity, non-condensing
0
95
%RH
7.3 ESD Ratings
VALUE
UNIT
All pins except MBRST[15:0]
±2000
Electrostatic
Human-body model (HBM), per
V(ESD)
V
discharge
ANSI/ESDA/JEDEC JS-001(1)
Pins MBRST[15:0]
±250
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
Copyright © 2012–2015, Texas Instruments Incorporated
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