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DLP9500UV 데이터시트(PDF) 2 Page - Texas Instruments

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부품명 DLP9500UV
상세설명  LVDS Type A DMD
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제조업체  TI1 [Texas Instruments]
홈페이지  http://www.ti.com
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DLP9500UV 데이터시트(HTML) 2 Page - Texas Instruments

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DLP9500UV
DLPS033B – NOVEMBER 2014 – REVISED JUNE 2015
www.ti.com
Table of Contents
8.3
Feature Description................................................. 24
1
Features .................................................................. 1
8.4
Device Functional Modes........................................ 31
2
Applications ........................................................... 1
8.5
Window Characteristics and Optics ....................... 33
3
Description ............................................................. 1
8.6
Micromirror Array Temperature Calculation............ 34
4
Revision History..................................................... 2
8.7
Micromirror Landed-On and Landed-Off Duty
5
Description (continued)......................................... 3
Cycle ........................................................................ 36
6
Pin Configuration and Functions ......................... 3
9
Application and Implementation ........................ 38
7
Specifications....................................................... 12
9.1
Application Information............................................ 38
7.1
Absolute Maximum Ratings .................................... 12
9.2
Typical Application ................................................. 40
7.2
Storage Conditions.................................................. 12
10
Power Supply Recommendations ..................... 42
7.3
ESD Ratings............................................................ 12
10.1
Power-Up Sequence (Handled by the DLPC410) 42
7.4
Recommended Operating Conditions ..................... 13
10.2
DMD Power-Up and Power-Down Procedures..... 42
7.5
Thermal Information ................................................ 13
11
Layout................................................................... 43
7.6
Electrical Characteristics......................................... 14
11.1
Layout Guidelines ................................................. 43
7.7
LVDS Timing Requirements ................................... 15
11.2
Layout Example .................................................... 45
7.8
LVDS Waveform Requirements .............................. 16
12
Device and Documentation Support ................. 45
7.9
Serial Control Bus Timing Requirements................ 17
12.1
Device Support .................................................... 45
7.10
Systems Mounting Interface Loads....................... 18
12.2
Documentation Support ........................................ 46
7.11
Micromirror Array Physical Characteristics ........... 19
12.3
Community Resources.......................................... 46
7.12
Micromirror Array Optical Characteristics ............. 20
12.4
Trademarks ........................................................... 46
7.13
Chipset Component Usage Specification ............. 21
12.5
Electrostatic Discharge Caution ............................ 46
8
Detailed Description ............................................ 22
12.6
Glossary ................................................................ 47
8.1
Overview ................................................................. 22
13
Mechanical, Packaging, and Orderable
8.2
Functional Block Diagram ....................................... 23
Information ........................................................... 47
4 Revision History
Changes from Revision A (June 2015) to Revision B
Page
Released full data sheet and updated device status to production data................................................................................ 1
Added 7.00 mm measurement to BODY SIZE in Device Information. .................................................................................. 1
Added environmental parameters to Absolute Maximum Ratings ...................................................................................... 12
Moved VESD to ESD Ratings................................................................................................................................................. 12
Updated the MAX value of the illumination power density for >420 nm in Recommended Operating Conditions ............. 13
Added new notes to Recommended Operating Conditions. ............................................................................................... 13
Added new note to Thermal Information ............................................................................................................................. 13
Replaced Figure 3. ............................................................................................................................................................... 17
Changed units in Systems Mounting Interface Loads from lbs to N. .................................................................................. 18
Added Chipset Component Usage Specification ................................................................................................................ 21
Corrected 6.33 W to 6.83 W in TArray sample calculation .................................................................................................... 35
Updated Figure 20 ............................................................................................................................................................... 42
Removed Thermal Considerations ...................................................................................................................................... 45
Changes from Original (November 2014) to Revision A
Page
Updated device status to product preview for release .......................................................................................................... 1
Updated front page graphic ................................................................................................................................................... 1
Added Community Resources ............................................................................................................................................. 46
2
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