Package information

BAL-CW1250D3

4/10

DocID024678 Rev 2

2

Package information

•

Epoxy meets UL94, V0

•

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

2.1

Flip-Chip package information

Figure 8. Flip-Chip package outline

Table 4. Flip-Chip package mechanical data

Parameter

Description

Min.

Typ.

Max.

Unit

A

Bump height + substrate thickness

0.570

0.630

0.690

mm

A1

Bump height

0.155

0.205

0.255

mm

A2

Substrate thickness

0.400

mm

b

Bump diameter

0.215

0.255

0.295

mm

D

Y dimension of the die

1.150

1.200

1.250

mm

D1

Y pitch

0.760

mm

E

X dimension of the die

0.940

0.990

1.040

mm

E1

X pitch

0.400

mm

fD

Distance from bump to edge of die on Y axis

0.105

mm

ccc

0.05

mm

$0.025

mm