TPD1E10B06

SLLSEB1D – FEBRUARY 2012 – REVISED NOVEMBER 2015

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6.4 Thermal Information

TPD1E10B06

DPY (X1SON)

UNIT

2 PINS

Junction-to-ambient thermal resistance

615.5

°C/W

Junction-to-case (top) thermal resistance

404.8

°C/W

Junction-to-board thermal resistance

493.3

°C/W

Junction-to-top characterization parameter

127.7

°C/W

Junction-to-board characterization parameter

493.3

°C/W

Junction-to-case (bottom) thermal resistance

162

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

Reverse stand-off voltage

Pin 1 to 2 or Pin 2 to 1

5.5

V

Leakage current

Pin 1 = 5 V, Pin 2 = 0 V

100

nA

(1)

10

Clamp voltage with ESD strike on pin 1, pin 2

VClamp1,2

V

grounded.

(1)

14

(1)

8.5

Clamp voltage with ESD strike on pin 2, pin 1

VClamp2,1

V

grounded.

(1)

14

0.32

Dynamic resistance

Ω

0.38

I/O capacitance

12

pF

Break-down voltage, pin 1 to pin 2

6

V

Break-down voltage, pin 2 to pin 1

6

V

(1)

Nonrepetitive current pulse 8 to 20 µs exponentially decaying waveform according to IEC 61000-4-5

(2)

4

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