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74LVCH8T245NSRG4 데이터시트(PDF) 5 Page - Texas Instruments |
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74LVCH8T245NSRG4 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 33 page 5 SN74LVCH8T245 www.ti.com SCES637B – AUGUST 2005 – REVISED FEBRUARY 2016 Product Folder Links: SN74LVCH8T245 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Recommended Operating Conditions (continued) over operating free-air temperature range (unless otherwise noted) (1)(2)(3) MIN MAX UNIT (5) For VCCA values not specified in the data sheet, VIH min = VCCA × 0.7 V, VIL (max) = VCCA × 0.3 V. VIH High-level input voltage Control inputs (referenced to VCCA) (5) VCCI = 1.65 V to 4.5 V VCCA × 0.65 V VCCI = 2.3 V to 2.7 V 1.7 VCCI = 3 V to 3.6 V 2 VCCI = 4.5 V to 5.5 V VCCA × 0.7 VIL Low-level input voltage Control inputs (referenced to VCCA) (5) VCCI = 1.65 V to 4.5 V VCCA × 0.35 V VCCI = 2.3 V to 2.7 V 0.7 VCCI = 3 V to 3.6 V 0.8 VCCI = 4.5 V to 5.5 V VCCA × 0.3 VI Input voltage Control inputs(3) 0 5.5 V VI/O Input/output voltage(2) Active state 0 VCCO V 3-State 0 5.5 IOH High-level output current VCCO = 1.65 V to 4.5 V –4 mA VCCO = 2.3 V to 2.7 V –8 VCCO = 3 V to 3.6 V –24 VCCO = 4.5 V to 5.5 V –32 IOL Low-level output current VCCO = 1.65 V to 4.5 V 4 mA VCCO = 2.3 V to 2.7 V 8 VCCO = 3 V to 3.6 V 24 VCCO = 4.5 V to 5.5 V 32 Δt/Δv Input transition rise or fall rate Data inputs VCCI = 1.65 V to 4.5 V 20 ns/V VCCI = 2.3 V to 2.7 V 20 VCCI = 3 V to 3.6 V 10 VCCI = 4.5 V to 5.5 V 5 TA Operating free-air temperature –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) SN74LVCH8T245 UNIT DB (SSOP) DGV (TVSOP) PW (TSSOP) RHL (VQFN) 24 PINS 24 PINS 24 PINS 24 PINS RθJA Junction-to-ambient thermal resistance 88.5 91.1 90.6 37.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 48.7 23.7 27.6 38.1 °C/W RθJB Junction-to-board thermal resistance 44.1 44.5 45.3 15.2 °C/W ψJT Junction-to-top characterization parameter 12.8 0.6 1.3 0.7 °C/W ψJB Junction-to-board characterization parameter 43.6 44.1 44.8 15.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — 4.3 °C/W |
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