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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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CSD17577Q3A 데이터시트(PDF) 3 Page - Texas Instruments |
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CSD17577Q3A 데이터시트(HTML) 3 Page - Texas Instruments |
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3 / 13 page  CSD17577Q3A www.ti.com SLPS515A – AUGUST 2014 – REVISED JANUARY 2016 5 Specifications 5.1 Electrical Characteristics (TA = 25°C unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT STATIC CHARACTERISTICS BVDSS Drain-to-source voltage VGS = 0 V, ID = 250 μA 30 V IDSS Drain-to-source leakage current VGS = 0 V, VDS = 24 V 1 μA IGSS Gate-to-source leakage current VDS = 0 V, VGS = 20 V 100 nA VGS(th) Gate-to-source threshold voltage VDS = VGS, ID = 250 μA 1.1 1.4 1.8 V VGS = 4.5 V, ID = 10 A 5.3 6.4 m Ω RDS(on) Drain-to-source on-resistance VGS = 10 V, ID = 16 A 4.0 4.8 m Ω gfs Transconductance VDS = 15 V, ID = 16 A 76 S DYNAMIC CHARACTERISTICS Ciss Input capacitance 1780 2310 pF Coss Output capacitance VGS = 0 V, VDS = 15 V, ƒ = 1 MHz 208 270 pF Crss Reverse transfer capacitance 79 103 pF RG Series gate resistance 1.4 2.8 Ω Qg Gate charge total (4.5 V) 13 17 nC Qg Gate charge total (10 V) 27 35 nC Qgd Gate charge gate-to-drain VDS = 15 V, ID = 16 A 2.8 nC Qgs Gate charge gate-to-source 5.1 nC Qg(th) Gate charge at Vth 2.5 nC Qoss Output charge VDS = 15 V, VGS = 0 V 6 nC td(on) Turn on delay time 4 ns tr Rise time 31 ns VDS = 15 V, VGS = 10 V, IDS = 16 A, RG = 0 Ω td(off) Turn off delay time 20 ns tf Fall time 4 ns DIODE CHARACTERISTICS VSD Diode forward voltage ISD = 16 A, VGS = 0 V 0.8 1 V Qrr Reverse recovery charge 8.2 nC VDS= 15 V, IF = 16 A, di/dt = 300 A/ μs trr Reverse recovery time 8.6 ns 5.2 Thermal Information (TA = 25°C unless otherwise stated) THERMAL METRIC MIN TYP MAX UNIT RθJC Junction-to-case thermal resistance(1) 3.0 °C/W RθJA Junction-to-ambient thermal resistance(1)(2) 55 °C/W (1) RθJC is determined with the device mounted on a 1 inch 2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu pad on a 1.5 inches × 1.5 inches (3.81 cm × 3.81 cm), 0.06 inch (1.52 mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design. (2) Device mounted on FR4 material with 1 inch2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu. Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: CSD17577Q3A |
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