SN74CB3Q3257

SCDS135B – SEPTEMBER 2003 – REVISED JUNE 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

–0.5

4.6

V

–0.5

7

V

–0.5

7

V

Control input clamp current

–50

mA

I/O port clamp current

–50

mA

ON-state switch current

±64

mA

±100

mA

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(4)

6.2 ESD Ratings

VALUE

UNIT

2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

2.3

3.6

V

1.7

5.5

High-level control input voltage

V

2

5.5

0

0.7

Low-level control input voltage

V

0

0.8

Data input/output voltage

0

5.5

V

Operating free-air temperature

–40

85

°C

(1)

Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

SN74CB3Q3257

DB

DBQ

DGV

D (SOIC)

PW (TSSOP)

RGY (VQFN)

(SSOP)

(SSOP)

(TVSOP)

UNIT

16

16 PINS

16 PINS

16 PINS

16 PINS

16 PINS

PINS

Junction-to-ambient thermal resistance

73

82

90

120

108

39

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

Submit Documentation Feedback

Copyright © 2003–2015, Texas Instruments Incorporated

Product Folder Links: SN74CB3Q3257