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TS5A3359 데이터시트(PDF) 4 Page - Texas Instruments

부품명 TS5A3359
상세설명  SP3T Bidirectional Analog Switch
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홈페이지  http://www.ti.com
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TS5A3359 데이터시트(HTML) 4 Page - Texas Instruments

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TS5A3359
SCDS214E – OCTOBER 2005 – REVISED JANUARY 2016
www.ti.com
Product Folder Links: TS5A3359
Submit Documentation Feedback
Copyright © 2005–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(3)
All voltages are with respect to ground, unless otherwise specified.
(4)
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(5)
This value is limited to 5.5-V maximum.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VCC
Supply voltage(3)
–0.5
6.5
V
VNO
VCOM
Analog voltage(3) (4) (5)
–0.5
VCC + 0.5
V
IK
Analog port diode current
VNO, VCOM < 0
–50
mA
INO
ICOM
On-state switch current
VNO, VCOM = 0 to VCC
–200
200
mA
–400
400
VI
Digital input voltage(3) (4)
–0.5
6.5
V
IIK
Digital input clamp current
VI < 0
–50
mA
ICC
Continuous current through VCC
100
mA
IGND
Continuous current through GND
–100
100
mA
Tstg
Storage temperature
–65
150
°C
TJ
Junction temperature
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±2000
V
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins(2)
±1000
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Analog voltage
1.65
5.5
V
VNO
VCOM
0
VCC
V
VI
Digital input voltage
0
VCC
V
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1)
TS5A3359
UNIT
DCU (US8)
YZP (DSBGA)
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
204.2
105.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
76.2
1.6
°C/W
RθJB
Junction-to-board thermal resistance
82.9
10.8
°C/W
ψJT
Junction-to-top characterization parameter
7.6
3.1
°C/W
ψJB
Junction-to-board characterization parameter
82.5
10.8
°C/W


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