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TS5A3359 데이터시트(PDF) 4 Page - Texas Instruments |
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TS5A3359 데이터시트(HTML) 4 Page - Texas Instruments |
4 / 34 page 4 TS5A3359 SCDS214E – OCTOBER 2005 – REVISED JANUARY 2016 www.ti.com Product Folder Links: TS5A3359 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum (3) All voltages are with respect to ground, unless otherwise specified. (4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (5) This value is limited to 5.5-V maximum. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VCC Supply voltage(3) –0.5 6.5 V VNO VCOM Analog voltage(3) (4) (5) –0.5 VCC + 0.5 V IK Analog port diode current VNO, VCOM < 0 –50 mA INO ICOM On-state switch current VNO, VCOM = 0 to VCC –200 200 mA –400 400 VI Digital input voltage(3) (4) –0.5 6.5 V IIK Digital input clamp current VI < 0 –50 mA ICC Continuous current through VCC 100 mA IGND Continuous current through GND –100 100 mA Tstg Storage temperature –65 150 °C TJ Junction temperature 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Analog voltage 1.65 5.5 V VNO VCOM 0 VCC V VI Digital input voltage 0 VCC V (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) TS5A3359 UNIT DCU (US8) YZP (DSBGA) 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 204.2 105.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 76.2 1.6 °C/W RθJB Junction-to-board thermal resistance 82.9 10.8 °C/W ψJT Junction-to-top characterization parameter 7.6 3.1 °C/W ψJB Junction-to-board characterization parameter 82.5 10.8 °C/W |
유사한 부품 번호 - TS5A3359_16 |
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유사한 설명 - TS5A3359_16 |
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