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CD4052BF 데이터시트(PDF) 5 Page - Texas Instruments |
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CD4052BF 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 38 page CD4051B, CD4052B, CD4053B www.ti.com SCHS047H – AUGUST 1998 – REVISED APRIL 2015 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply Voltage V+ to V-, Voltages Referenced to VSS Terminal –0.5 20 V DC Input Voltage –0.5 VDD + 0.5 V DC Input Current Any One Input –10 10 mA TJMAX1 Maximum junction temperature, ceramic package 175 °C TJMAX2 Maximum junction temperature, plastic package 150 °C TLMAX Maximum lead temperature, SOIC - Lead Tips Only, Soldering 10s 265 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT CD4051B in PDIP, CDIP, SOIC, SOP, TSSOP Packages Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) +3000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- +2000 C101(2) CD4053B in PDIP, CDIP, SOP and TSSOP Packages Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) +2500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- +1500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Temperature Range –55 125 °C 6.4 Thermal Information CD405xB PW THERMAL METRIC(1) E (PDIP) M (SOIC) NS (SOP) UNIT (TSSOP) 16 PINS 16 PINS 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 67 73 64 108 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 1998–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: CD4051B CD4052B CD4053B |
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