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74AHCT1G04DCKTG4 데이터시트(PDF) 4 Page - Texas Instruments |
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74AHCT1G04DCKTG4 데이터시트(HTML) 4 Page - Texas Instruments |
4 / 19 page SN74AHCT1G04 SCLS319P – MARCH 1996 – REVISED DECEMBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage range –0.5 7 V VI Input voltage range(2) –0.5 7 V VO Output voltage range(2) –0.5 VCC + 0.5 V IIK Input clamp current VI < 0 –20 mA IOK Output clamp current VO < 0 or VO > VCC ±20 mA IO Continuous output current VO = 0 to VCC ±25 mA Continuous current through VCC or GND ±50 mA Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions() is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 1500 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, 1000 all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions (1) MIN MAX UNIT VCC Supply voltage 4.5 5.5 V VIH High-level input voltage 2 V VIL Low-level Input voltage 0.8 V VI Input voltage 0 5.5 V VO Output voltage 0 VCC V IOH High-level output current –8 mA IOL Low-level output current 8 mA Δt/Δv Input Transition rise or fall rate 20 ns/V TA Operating free-air temperature –40 125 °C (1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004) 7.4 Thermal Information SN74AHCT1G04 THERMAL METRIC(1) DBV DCK UNIT 5 PINS RθJA Junction-to-ambient thermal resistance 231.3 287.6 RθJC(top) Junction-to-case (top) thermal resistance 119.9 97.7 RθJB Junction-to-board thermal resistance 60.6 65. °C/W ψJT Junction-to-top characterization parameter 17.8 2.0 ψJB Junction-to-board characterization parameter 60.1 64.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). 4 Submit Documentation Feedback Copyright © 1996–2014, Texas Instruments Incorporated Product Folder Links: SN74AHCT1G04 |
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