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LM2671LD-ADJ 데이터시트(PDF) 4 Page - Texas Instruments |
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LM2671LD-ADJ 데이터시트(HTML) 4 Page - Texas Instruments |
4 / 36 page 4 LM2671 SNVS008L – SEPTEMBER 1998 – REVISED JUNE 2016 www.ti.com Product Folder Links: LM2671 Submit Documentation Feedback Copyright © 1998–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Supply voltage 45 V ON/OFF pin voltage, VSH −0.1 6 V Switch voltage to ground –1 V Boost pin voltage VSW + 8 V Feedback pin voltage, VFB −0.3 14 V Power dissipation Internally Limited Lead temperature D package Vapor phase (60 s) 215 °C Infrared (15 s) 220 P package (soldering, 10 s) 260 WSON package See AN-1187 Maximum junction temperature 150 °C Storage temperature, Tstg −65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V 7.3 Recommended Operating Conditions MIN MAX UNIT Supply voltage 6.5 40 V Junction temperature, TJ –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) Junction to ambient thermal resistance with approximately 1 square inch of printed-circuit board copper surrounding the leads. Additional copper area lowers thermal resistance further. The value RθJA for the WSON (NHN) package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, see AN-1187 Leadless Leadframe Package (LLP). 7.4 Thermal Information THERMAL METRIC(1) LM2674 UNIT D (SOIC) P (PDIP) NHN (WSON) 8 PINS 8 PINS 16 PINS RθJA Junction-to-ambient thermal resistance(2) 105 95 — °C/W |
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