4

LM317L-N

SNVS775K – MARCH 2000 – REVISED APRIL 2016

www.ti.com

Product Folder Links: LM317L-N

Submit Documentation Feedback

Copyright © 2000–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

6 Specifications

6.1 Absolute Maximum Rating

(1) (2)

MIN

MAX

UNIT

Power dissipation

Internally Limited

Input-output voltage differential

40

V

Operating junction temperature

−40

125

°C

Lead temperature (soldering, 4 seconds)

260

°C

−55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000

V may actually have higher performance.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Operating temperature

−40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

LM317L-N

UNIT

TO-92

SOIC

DSBGA

3 PINS

8 PINS

6 PINS

0.4-in

Leads

0.125-in

Leads

Junction-to-ambient thermal resistance

180

160

165

290

°C/W

—

80.6

—

—

°C/W

Junction-to-board thermal resistance

—

—

—

—

°C/W

Junction-to-top characterization parameter

—

24.7

—

—

°C/W

Junction-to-board characterization parameter

—

135.8

—

—

°C/W

—

—

—

—

°C/W