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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LM3209-G3 데이터시트(PDF) 3 Page - Texas Instruments |
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LM3209-G3 데이터시트(HTML) 3 Page - Texas Instruments |
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3 / 22 page  LM3209-G3 www.ti.com SNVS626B – NOVEMBER 2009 – REVISED MARCH 2013 ABSOLUTE MAXIMUM RATINGS (1) (2) (3) PVIN pin: Voltage to GND −0.2V to +6.0V EN, FB, VCON, VOUT pin: Voltage to GND −0.2V) to (VIN +0.2V) w/6.0V max. PGND to SGND −0.2V to +0.2V SW1, SW2 (PGND −0.2V) to (PVIN +0.2V) w/6.0V Continuous Power Dissipation(4) Internally Limited Junction Temperature (TJ-MAX) +150°C Storage Temperature Range −65°C to +150°C Maximum Lead Temperature (Soldering 10 sec.) +260°C ESD Rating, Human Body Model(5)(6) 2kV (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the potential at the GND pins. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and disengages at TJ = 120°C (typ.). (5) The Human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. (MIL-STD-883 3015.7) (6) Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper ESD handling procedure can result in damage. OPERATING RATINGS (1) (2) Input Voltage Range 2.7V to 5.5V Recommended Load Current 0 to 650 mA Junction Temperature (TJ) Range −30°C to +125°C Ambient Temperature (TA) Range (3) −30°C to +85°C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the potential at the GND pins. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). THERMAL PROPERTIES Junction-to-Ambient Thermal, Resistance ( θJA), YZR Package 85°C/W Copyright © 2009–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3209-G3 |
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