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SN54HC02, SN74HC02

SCLS076F – DECEMBER 1982 – REVISED APRIL 2015

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Copyright © 1982–2015, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

–0.5

7

V

±20

mA

±20

mA

Continuous output current

±25

mA

±50

mA

Operating virtual junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings – SN74HC02

VALUE

UNIT

Electrostatic discharge

±1500

V

±2000

(1)

Implications of Slow or Floating CMOS Inputs, SCBA004.

6.3 Recommended Operating Conditions

See

MIN

NOM

MAX

UNIT

Supply voltage

2

5

6

V

High-level input voltage

1.5

V

3.15

4.2

Low-level input voltage

0.5

V

1.35

1.8

Input voltage

0

V

Output voltage

0

V

∆t/∆v

Input transition rise and fall time

1000

ns/V

500

400

Operating free-air temperature

SN54HC02

–55

125

°C

SN74HC02

–40

85