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LM317KSTEEL 데이터시트(PDF) 6 Page - Texas Instruments |
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6 / 48 page LM117, LM317-N SNVS774P – MAY 2004 – REVISED OCTOBER 2015 www.ti.com 7.5 Thermal Information, LM317-N LM317-N KTT NDE DCY NDT NDP THERMAL METRIC(1)(2) UNIT (TO-263) (TO-220) (SOT-223) (TO) (TO-252) 3 PINS 3 PINS 4 PINS 3 PINS 3 PINS RθJA Junction-to-ambient thermal resistance 41.0 23.3 59.6 186(3) 54 °C/W RθJC(top) Junction-to-case (top) thermal resistance 43.6 16.2 39.3 21 51.3 °C/W RθJB Junction-to-board thermal resistance 23.6 4.9 8.4 — 28.6 °C/W ψJT Junction-to-top characterization parameter 10.4 2.7 1.8 — 3.9 °C/W ψJB Junction-to-board characterization parameter 22.6 4.9 8.3 — 28.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 1.1 — — 0.9 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) When surface mount packages are used (SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by increasing the PCB copper area that is thermally connected to the package. See Heatsink Requirements for heatsink techniques. (3) No heatsink 7.6 LM117 Electrical Characteristics Some specifications apply over full Operating Temperature Range as noted. Unless otherwise specified, TJ = 25°C, VIN − VOUT = 5 V, and IOUT = 10 mA. (1) (2) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 3 V ≤ (VIN − VOUT) ≤ 40 V, Reference voltage 1.2 1.25 1.3 V 10 mA ≤ IOUT ≤ IMAX (1) (over full operating temperature range) TJ = 25°C 0.01 0.02 Line regulation 3 V ≤ (VIN − VOUT) ≤ 40 V (3) %/V over full operating 0.02 0.05 temperature range TJ = 25°C 0.1% 0.3% Load regulation 10 mA ≤ IOUT ≤ IMAX (1) (3) over full operating 0.3% 1% temperature range Thermal regulation 20-ms pulse 0.03 0.07 %/W Adjustment pin current over full operating temperature range 50 100 μA 10 mA ≤ IOUT ≤ IMAX (1) Adjustment pin current change 0.2 5 μA 3 V ≤ (VIN − VOUT) ≤ 40 V (over full operating temperature range) Temperature stability TMIN ≤ TJ ≤ TMAX (over full operating temperature range) 1% Minimum load current (VIN − VOUT) = 40 V (over full operating temperature range) 3.5 5 mA TO-3 Package (over full 1.5 2.2 3.4 operating temperature range) (VIN − VOUT) ≤ 15 V A TO-39 Package (over full 0.5 0.8 1.8 Current limit operating temperature range) TO-3 package 0.3 0.4 (VIN − VOUT) = 40 V A TO-39 package 0.15 0.2 RMS output noise, % of VOUT 10 Hz ≤ f ≤ 10 kHz 0.003% VOUT = 10 V, f = 120 Hz, CADJ = 0 μF (over full operating 65 dB temperature range) Ripple rejection ratio VOUT = 10 V, f = 120 Hz, CADJ = 10 μF (over full operating 66 80 dB temperature range) Long-term stability TJ = 125°C, 1000 hrs 0.3% 1% (1) IMAX = 1.5 A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0 A for the DCY (SOT-223) package. IMAX = 0.5 A for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device maximum junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any temperature is : PD(MAX) = ((TJ(MAX) – TA) / θJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL). (2) Specifications and availability for military and space grades of LM117/883 can be found in the LM117QML data sheet (SNVS356). Specifications and availability for military and space grades of LM117 can be found in the LM117JAN data sheet (SNVS365). (3) Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specifications for thermal regulation. 6 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N |
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