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DESCRIPTION

1

2

3

4

8

7

6

5

IN1–

IN1+

GND

IN2–

IN2+

D OR DGN PACKAGE

(TOP VIEW)

FUNCTIONAL BLOCK DIAGRAM

Short-Circuit

Protection

Over-Temperature

Protection

8

IN1−

IN1+

IN2−

IN2+

2

3

6

5

1

7

4

To Headphone

Jack

(See TPA152)

TPA112

SLOS212E – AUGUST 1998 – REVISED JUNE 2004

150-mW STEREO AUDIO POWER AMPLIFIER

•

150-mW Stereo Output

The TPA112 is a stereo audio power amplifier pack-

aged in an 8-pin PowerPAD™ MSOP package

•

Wide Range of Supply Voltages

capable of delivering 150 mW of continuous RMS

– Fully Specified for 3.3-V and 5-V Operation

power per channel into 8-

Ω loads. Amplifier gain is

– Operational From 2.5 V to 5.5 V

externally configured by means of two resistors per

•

Thermal and Short-Circuit Protection

input channel and does not require external compen-

sation for settings of 1 to 10.

•

Surface-Mount Packaging

THD+N when driving an 8-

Ω load from 5 V is 0.1% at

– PowerPAD™ MSOP

1 kHz, and less than 2% across the audio band of 20

– SOIC

Hz to 20 kHz. For 32-

Ω loads, the THD+N is reduced

•

Standard Operational Amplifier Pinout

to less than 0.06% at 1 kHz, and is less than 1%

across the audio band of 20 Hz to 20 kHz. For 10-k

Ω

loads, the THD+N performance is 0.01% at 1 kHz,

and less than 0.02% across the audio band of 20 Hz

to 20 kHz.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 1998–2004, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.