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TPA6211A1-Q1 데이터시트(PDF) 3 Page - Texas Instruments |
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TPA6211A1-Q1 데이터시트(HTML) 3 Page - Texas Instruments |
3 / 33 page Not to scale Thermal Pad 1 SHUTDOWN 8 V O– 2 BYPASS 7 GND 3 IN+ 6 VDD 4 IN– 5 V O+ 3 TPA6211A1-Q1 www.ti.com SBOS555C – JUNE 2011 – REVISED AUGUST 2016 Product Folder Links: TPA6211A1-Q1 Submit Documentation Feedback Copyright © 2011–2016, Texas Instruments Incorporated 5 Pin Configuration and Functions DGN Package 8-Pin MSOP-PowerPAD Top View Pin Functions PIN I/O DESCRIPTION NAME NO. BYPASS 2 I Mid-supply voltage, adding a bypass capacitor improves PSRR GND 7 I High-current ground IN– 4 I Negative differential input IN+ 3 I Positive differential input SHUTDOWN 1 I Shutdown pin (active low logic) Thermal Pad — — Connect to ground. Thermal pad must be soldered down in all applications to properly secure device on the PCB. VDD 6 I Power supply VO+ 5 O Positive BTL output VO– 8 O Negative BTL output (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range unless otherwise noted (1) MIN MAX UNIT Supply voltage, VDD –0.3 6 V Input voltage, VI –0.3 VDD + 0.3 V V Continuous total power dissipation See Dissipation Ratings Lead temperature 1.6 mm (1/16 Inch) from case for 10 s DGN 260 °C Operating free-air temperature, TA –40 105 °C Junction temperature, TJ –40 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 |
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