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TPL5110DDCR 데이터시트(PDF) 4 Page - Texas Instruments |
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TPL5110DDCR 데이터시트(HTML) 4 Page - Texas Instruments |
4 / 26 page 4 TPL5110 SNAS650 – JANUARY 2015 – REVISED JANUARY 2015 www.ti.com Product Folder Links: TPL5110 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The voltage between any two pins should not exceed 6V. (3) The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board. 7 Specifications 7.1 Absolute Maximum Ratings (1) MIN MAX UNIT Supply Voltage (VDD-GND) -0.3 6.0 V Input Voltage at any pin(2) -0.3 VDD + 0.3 V Input Current on any pin -5 +5 mA Storage Temperature, Tstg -65 150 °C Junction Temperature, TJ(3) 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human Body Model, per ANSI/ESDA/JEDEC JS-001(1) ±1000 V Charged-device model (CDM), per JEDEC specification JESD22-101(2) ±250 7.3 Recommended Operating Ratings MIN MAX UNIT Supply Voltage (VDD-GND) 1.8 5.5 V Temperature Range -40 105 °C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) TPL5110 UNIT SOT23 6 PINS RθJA Junction-to-ambient thermal resistance 163 °C/W RθJC(top) Junction-to-case (top) thermal resistance 26 RθJB Junction-to-board thermal resistance 57 ψJT Junction-to-top characterization parameter 7.5 ψJB Junction-to-board characterization parameter 57 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A |
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