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DBVPACKAGE

(TOP VIEW)

3

2

4

5

1

NC

V

CC

Y

A

GND

Seemechanicaldrawingsfordimensions.

NC-Nointernalconnection

DESCRIPTION/ORDERING INFORMATION

SN74AUC1G14-EP

SINGLE SCHMITT-TRIGGER INVERTER

SCES673 – SEPTEMBER 2006

•

Controlled Baseline

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

– One Assembly/Test Site, One Fabrication

Site

•

ESD Protection Exceeds JESD 22

•

Extended Temperature Performance of –55

°C

– 2000-V Human-Body Model (A114-A)

to 125

°C

– 200-V Machine Model (A115-A)

•

Enhanced Diminishing Manufacturing

– 1000-V Charged-Device Model (C101)

Sources (DMS) Support

•

Enhanced Product-Change Notification

•

•

Available in the Texas Instruments

NanoStar™ and NanoFree™ Packages

•

Optimized for 1.8-V Operation and Is 3.6-V I/O

Tolerant to Support Mixed-Mode Signal

Operation

•

I

Operation

•

Sub-1-V Operable

•

Max t

•

Low Power Consumption, 10-

µA Max I

CC

•

±8-mA Output Drive at 1.8 V

(1)

Component qualification in accordance with JEDEC and

industry standards to ensure reliable operation over an

extended temperature range. This includes, but is not limited

to, Highly Accelerated Stress Test (HAST) or biased 85/85,

temperature cycle, autoclave or unbiased HAST,

electromigration, bond intermetallic life, and mold compound

life. Such qualification testing should not be viewed as

justifying use of this component beyond specified

performance and environmental limits.

The SN74AUC1G14 contains one inverter and performs the Boolean function Y = A. The device functions as an

independent inverter, but because of Schmitt action, it may have different input threshold levels for

ORDERING INFORMATION

ORDERABLE PART NUMBER

–55

°C to 125°C

SOT (SOT-23) – DBV

Reel of 3000

SN74AUC1G14MDBVREP

U14_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV: The actual top-side marking has one additional character that designates the assembly/test site. Pin 1 identifier indicates

solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2006, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.