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TEA1654T 데이터시트(PDF) 11 Page - NXP Semiconductors |
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TEA1654T 데이터시트(HTML) 11 Page - NXP Semiconductors |
11 / 24 page 2003 May 12 11 Philips Semiconductors Product specification GreenChip ™II SMPS control IC TEA1654 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); note 1. Notes 1. All voltages are measured with respect to ground; positive currents flow into the chip; pin VCC must not be current driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the maximum power rating is not violated. 2. Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 k Ω series resistor. 3. Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor. THERMAL CHARACTERISTICS Note 1. With pin GND connected to sufficient copper area on the printed-circuit board. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Voltages VVCOadj voltage on pin VCOadj continuous −0.4 +5 V Vsense voltage on pin Isense current limited −0.4 − V VDRAIN voltage on pin DRAIN −0.4 +650 V VCC supply voltage continuous −0.4 +20 V VLOCK voltage on pin LOCK continuous −0.4 +7 V VCTRL voltage on pin CTRL −0.4 +5 V VDEM voltage on pin DEM current limited −0.4 − V Currents Isense current on pin Isense −1 +10 mA ISTDBY current on pin STDBY −1 − mA IDRIVER current on pin DRIVER d < 10% −0.8 +2 A IDRAIN current on pin DRAIN − +5 mA ICC(5V) current on pin VCC(5V) −10 mA ICTRL current on pin CTRL − +5 mA IDEM current on pin DEM −250 +250 µA General Ptot total power dissipation Tamb <70 °C − 0.75 W Tstg storage temperature −55 +150 °C Tj junction temperature −20 +145 °C ESD Vesd electrostatic discharge voltage pins 1 to 6 and pins 9 to 14 HBM class 1; note 2 − 2000 V pin 7 HBM class 1; note 2 − 1500 V any other pin MM; note 3 − 400 V SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient in free air; note 1 100 K/W |
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