전자부품 데이터시트 검색엔진 |
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LM2678 데이터시트(PDF) 5 Page - National Semiconductor (TI) |
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LM2678 데이터시트(HTML) 5 Page - National Semiconductor (TI) |
5 / 27 page All Output Voltage Versions Electrical Characteristics (Continued) Note 4: All limits are guaranteed at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits are 100% tested during production with TA =TJ = 25˚C. All limits at temperature extremes are guaranteed via correlation using standard standard Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Note 5: Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with 1⁄2 inch leads in a socket, or on a PC board with minimum copper area. Note 6: Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with 1⁄2 inch leads soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads. Note 7: Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Note 8: Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Note 9: Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal resistance further. See the thermal model in Switchers Made Simple® software. Note 10: Junction to ambient thermal resistance for the 14-lead LLP mounted on a PC board copper area equal to the die attach paddle. Note 11: Junction to ambient thermal resistance for the 14-lead LLP mounted on a PC board copper area using 12 vias to a second layer of copper equal to die attach paddle. Additional copper area will reduce thermal resistance further. For layout recommendations, refer to Application Note AN-1187. www.national.com 5 |
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