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전자부품 데이터시트 검색엔진 |
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LWY1SG-BFOO-EKFM-1 데이터시트(Datasheet) 15 Page - OSRAM GmbH |
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15 page ![]() Version 2.5 LW Y1SG 2015-06-12 15 Reflow Soldering Profile Reflow-Lötprofil Product complies to MSL Level 4 acc. to JEDEC J-STD-020D.01 0 0 s OHA04525 50 100 150 200 250 300 50 100 150 200 250 300 t T ˚C S t t P t T p 240 ˚C 217 ˚C 245 ˚C 25 ˚C L OHA04612 Profile Feature Profil-Charakteristik Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time t S T Smin to TSmax t S t L t P T L T P 100 120 60 10 20 30 80 100 217 2 3 245 260 3 6 Time 25 °C to T P Time within 5 °C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 100 °C All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range Ramp-up rate to peak*) T Smax to T P Liquidus temperature Peak temperature Time above liquidus temperature Symbol Symbol Unit Einheit Pb-Free (SnAgCu) Assembly Minimum Maximum Recommendation K/s K/s s s s s °C °C 480 |
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