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AD8231ACPZ-RL 데이터시트(PDF) 8 Page - Analog Devices |
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AD8231ACPZ-RL 데이터시트(HTML) 8 Page - Analog Devices |
8 / 25 page Data Sheet AD8231 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating Supply Voltage 6 V Output Short-Circuit Current Indefinite1 Input Voltage (Common-Mode) −VS − 0.3 V to +VS + 0.3 V Differential Input Voltage −VS − 0.3 V to +VS + 0.3 V Storage Temperature Range –65°C to +150°C Operational Temperature Range –40°C to +125°C Package Glass Transition Temperature 130°C ESD (Human Body Model) 1.5 kV ESD (Charged Device Model) 1.5 kV ESD (Machine Model) 0.2 kV 1 For junction temperatures between 105°C and 130°C, short-circuit operation beyond 1000 hours can impact part reliability. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Table 5. Thermal Pad θJA Unit Soldered to Board 54 °C/W Not Soldered to Board 96 °C/W The θJA values in Table 5 assume a 4-layer JEDEC standard board. If the thermal pad is soldered to the board, it is also assumed it is connected to a plane. θJC at the exposed pad is 6.3°C/W. MAXIMUM POWER DISSIPATION The maximum safe power dissipation for the AD8231 is limited by the associated rise in junction temperature (TJ) on the die. At approximately 130°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the parametric perform- ance of the amplifiers. Exceeding a temperature of 130°C for an extended period can result in a loss of functionality. ESD CAUTION Rev. C | Page 7 of 24 |
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