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ZSPM4521 데이터시트(PDF) 27 Page - Integrated Device Technology |
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ZSPM4521 데이터시트(HTML) 27 Page - Integrated Device Technology |
27 / 30 page ZSPM4521 Datasheet © 2016 Integrated Device Technology, Inc. 27 January 27, 2016 5 Layout Recommendations To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. 5.1. Multi-Layer PCB Layout The following are guidelines for mounting the exposed pad ZSPM4521 on a multi-layer PCB with ground a plane. In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias, and thickness of copper, etc. Figure 5.1 Package and PCB Land Configuration for Multi-Layer PCB Package Thermal Pad Solder Pad (Land Pattern) Thermal Vias Package Outline Figure 5.2 JEDEC Standard FR4 Multi-Layer Board – Cross-Sectional View (square) Package Solder Pad Package Solder Pad (bottom trace) Thermal Via Component Traces Thermal Isolation Power plane only 1.5748mm 0.0 - 0.071 mm Board Base & Bottom Pad 0.5246 - 0.5606 mm Power Plane (1oz Cu) 1.0142 - 1.0502 mm Ground Plane (1oz Cu) 1.5038 - 1.5748 mm Component Trace (2oz Cu) 2 Plane 4 Plane |
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