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LSM330D 데이터시트(PDF) 31 Page - STMicroelectronics

부품명 LSM330D
상세설명  Low power mode
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

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LSM330D
Application hints
Doc ID 022562 Rev 2
31/66
5
Application hints
Figure 13.
LSM330D electrical connection
5.1
External capacitors
The device core is supplied through Vdd line. Power supply decoupling capacitors (C1=C3 =
100 nF ceramic, C2=10 µF Al) should be placed as near as possible to the supply pin of the
device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Figure 13). The functionality of the device and the measured
acceleration/angular rate data are selectable and accessible through the SPI/I2C interface.
The functions, the threshold and the timing of the two interrupt pins for each sensor can be
completely programmed by the user though the SPI/I2C interface.
5.2
Soldering information
The LGA package is compliant with ECOPACK®, RoHS and “Green” standards. It is
qualified for soldering heat resistance according to JEDEC J-STD-020D.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
DIRECTION OF
DETECTABLE
ACCELERATIONS
DIRECTION OF
DETECTABLE
ANGULAR RATE
FILTVDD
FILTIN Y
(BOTTOM VIEW)
19
RES
RES
LSM330D
RES
18
28
5
1
4
15
DRDY_G
INT2_A
INT1_A
INT1_G
RES
14
GND
Vdd
GND
GND
C2
Vdd_IO
GND
100 nF
Digital signal from/to signal controller.Signals levels are defined by proper selection of Vdd
100 nF
10 µF
C1
C3
X
1
Y
Z
Z
1
Y
z
X
X
X
AM10233V1


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