1

FEATURES

DESCRIPTION

APPLICATIONS

Functional Schematic Diagram

INN

INP

GAIN0

SHUTDOWN

PGND

VCLAMP

BSN

OUTN

OUTN

PGND

VREF

BYPASS

COSC

ROSC

AGND

AGND

BSP

OUTP

GAIN1

OUTP

PGND

1

2

3

4

5

6

7

8

9

10

11

12

24

23

22

21

20

19

18

17

16

15

14

13

R3

51

Ω

C9

0.22

µF

C6

1

µF

D1

C12

220 pF

C11

1

µF

C3

1

µF

C4

1

µF

L2

(Ferrite

Bead)

L1

(Ferrite

Bead)

C15

1 nF

C14

1 nF

D2

R2

51

Ω

C8

0.22

µF

C5

1

µF

C7

10

µF

C10

1

µF

C1

0.47

µF

C2

0.47

µF

IN−

IN+

GAIN SELECT

GAIN SELECT

SHUTDOWN

CONTROL

U1

TPA3007D1

R1

120 k

Ω

TPA3007D1

SLOS418D – SEPTEMBER 2003 – REVISED MARCH 2008

www.ti.com

6.5-W MONO CLASS-D AUDIO POWER AMPLIFIER

• 6.5 W Into 8-Ω Load From 12-V Supply

(10% THD+N)

The TPA3007D1 is a 6.5-W mono bridge-tied load

(BTL) class-D audio power

amplifier

with

high

• Short Circuit Protection (Short to V

efficiency, eliminating the need for heat sinks. The

GND, Short Between Outputs)

TPA3007D1 can drive 8-

Ω speakers with only a

• Third-Generation Modulation Technique:

ferrite bead filter required to reduce EMI.

–

Replaces Large LC Filter With Small,

The gain of the amplifier is controlled by two input

Low-Cost Ferrite Bead Filter in Most

terminals,

GAIN1

and

GAIN0.

This

allows

the

Applications

amplifier to be configured for a gain of 12, 18, 23.6,

–

Improved Efficiency

and 36 dB. The differential input stage provides high

common mode rejection and improved power supply

–

Improved SNR

rejection.

• Low Supply Current ... mA Typ at 12 V

The amplifier also includes "de-pop" circuitry to

• Shutdown Control ... < 1µA Typ

reduce the amount of pop at power-up and when

cycling SHUTDOWN.

• LCD Monitors/TVs

The TPA3007D1 is available in the 24-pin TSSOP

package (PW) and does not require an external heat

• Desktop Replacement Notebook PCs

sink.

• Hands-Free Car Kits

• Powered Speakers

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2008, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.