전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

LM4961 데이터시트(PDF) 8 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
부품명 LM4961
상세설명  Ceramic Speaker Driver
Download  16 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  NSC [National Semiconductor (TI)]
홈페이지  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM4961 데이터시트(HTML) 8 Page - National Semiconductor (TI)

Back Button LM4961 Datasheet HTML 4Page - National Semiconductor (TI) LM4961 Datasheet HTML 5Page - National Semiconductor (TI) LM4961 Datasheet HTML 6Page - National Semiconductor (TI) LM4961 Datasheet HTML 7Page - National Semiconductor (TI) LM4961 Datasheet HTML 8Page - National Semiconductor (TI) LM4961 Datasheet HTML 9Page - National Semiconductor (TI) LM4961 Datasheet HTML 10Page - National Semiconductor (TI) LM4961 Datasheet HTML 11Page - National Semiconductor (TI) LM4961 Datasheet HTML 12Page - National Semiconductor (TI) Next Button
Zoom Inzoom in Zoom Outzoom out
 8 / 16 page
background image
Application Information
BRIDGE CONFIGURATION EXPLANATION
The Audio Amplifier portion of the LM4961 has two internal
amplifiers allowing different amplifier configurations. The first
amplifier’s gain is externally configurable, whereas the sec-
ond amplifier is internally fixed in a unity-gain, inverting
configuration. The closed-loop gain of the first amplifier is set
by selecting the ratio of Rf to Ri while the second amplifier’s
gain is fixed by the two internal 20k
Ω resistors. Figure 1
shows that the output of amplifier one serves as the input to
amplifier two. This results in both amplifiers producing sig-
nals identical in magnitude, but out of phase by 180˚. Con-
sequently, the differential gain for the Audio Amplifier is
A
VD = 2 *(Rf/Ri)
By driving the load differentially through outputs Vo1 and
Vo2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is
different from the classic single-ended amplifier configura-
tion where one side of the load is connected to ground.
A bridge amplifier design has a few distinct advantages over
the single-ended configuration. It provides differential drive
to the load, thus doubling the output swing for a specified
supply voltage. Four times the output power is possible as
compared to a single-ended amplifier under the same con-
ditions.
The bridge configuration also creates a second advantage
over single-ended amplifiers. Since the differential outputs,
Vo1 and Vo2, are biased at half-supply, no net DC voltage
exists across the load. This eliminates the need for an output
coupling capacitor which is required in a single supply,
single-ended amplifier configuration. Without an output cou-
pling capacitor, the half-supply bias across the load would
result in both increased internal IC power dissipation and
also possible loudspeaker damage.
AMPLIFIER POWER DISSIPATION
Power dissipation is a major concern when designing a
successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power
delivered to the load by a bridge amplifier is an increase in
internal power dissipation. Since the amplifier portion of the
LM4961 has two operational amplifiers, the maximum inter-
nal power dissipation is 4 times that of a single-ended am-
plifier. The maximum power dissipation for a given BTL
application can be derived from Equation 1.
P
DMAX(AMP) = 4(VDD)
2 /(2
π2Z
L)
(1)
where
Z
L =Ro1+Ro2 +1/2
πfc
BOOST CONVERTER POWER DISSIPATION
At higher duty cycles, the increased ON-time of the switch
FET means the maximum output current will be determined
by power dissipation within the LM4961 FET switch. The
switch power dissipation from ON-time conduction is calcu-
lated by Equation 2.
P
DMAX(SWITCH) =DCxIIND(AVE)
2 xR
DS(ON)
(2)
where DC is the duty cycle.
There will be some switching losses as well, so some derat-
ing needs to be applied when calculating IC power dissipa-
tion.
TOTAL POWER DISSIPATION
The total power dissipation for the LM4961 can be calculated
by adding Equation 1 and Equation 2 together to establish
Equation 3:
P
DMAX(TOTAL) = [4*(VDD)
2/
2
π2Z
L]+[DCxIIND(AVE)
2xR
DS(ON)]
(3)
The result from Equation 3 must not be greater than the
power dissipation that results from Equation 4:
P
DMAX =(TJMAX -TA)/
θJA
(4)
For the LQA28A,
θ
JA = 66˚C/W. TJMAX = 125˚C for the
LM4961. Depending on the ambient temperature, T
A,ofthe
system surroundings, Equation 4 can be used to find the
maximum internal power dissipation supported by the IC
packaging. If the result of Equation 3 is greater than that of
Equation 4, then either the supply voltage must be in-
creased, the load impedance increased or T
A reduced. For
the typical application of a 4.2V power supply, with a
2uF+30
Ω load, the maximum ambient temperature possible
without violating the maximum junction temperature is ap-
proximately 109˚C provided that device operation is around
the maximum power dissipation point. Thus, for typical ap-
plications, power dissipation is not an issue. Power dissipa-
tion is a function of output power and thus, if typical opera-
tion is not around the maximum power dissipation point, the
ambient temperature may be increased accordingly. Refer to
the Typical Performance Characteristics curves for power
dissipation information for lower output levels.
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATIONS
The LM4961’s exposed-DAP (die attach paddle) package
(LD) provides a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. The low
thermal resistance allows rapid heat transfer from the die to
the surrounding PCB copper traces, ground plane, and sur-
rounding air. The LD package should have its DAP soldered
to a copper pad on the PCB. The DAP’s PCB copper pad
may be connected to a large plane of continuous unbroken
copper. This plane forms a thermal mass, heat sink, and
radiation area. Further detailed and specific information con-
cerning PCB layout, fabrication, and mounting an LD (LLP)
package is found in National Semiconductor’s Package En-
gineering Group under application note AN1187.
SHUTDOWN FUNCTION
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry to provide a
quick, smooth transition into shutdown. Another solution is to
use a single-pole, single-throw switch connected between
V
DD and Shutdown pins.
BAND SWITCH FUNCTION
The LM4961 features a Band Switch function which allows
the user to use one amplifier for both receiver (earpiece)
mode and ringer/loudspeaker mode. When a logic high
www.national.com
8


유사한 부품 번호 - LM4961

제조업체부품명데이터시트상세설명
logo
Texas Instruments
LM4961 TI1-LM4961 Datasheet
1Mb / 23P
[Old version datasheet]   Ceramic Speaker Driver
LM4961 TI1-LM4961 Datasheet
1Mb / 24P
[Old version datasheet]   Ceramic Speaker Driver
LM4961LQ/NOPB TI1-LM4961LQ/NOPB Datasheet
1Mb / 24P
[Old version datasheet]   Ceramic Speaker Driver
LM4961LQBD TI1-LM4961LQBD Datasheet
1Mb / 23P
[Old version datasheet]   Ceramic Speaker Driver
LM4961LQBD TI1-LM4961LQBD Datasheet
1Mb / 24P
[Old version datasheet]   Ceramic Speaker Driver
More results

유사한 설명 - LM4961

제조업체부품명데이터시트상세설명
logo
Texas Instruments
LM4961 TI1-LM4961_14 Datasheet
1Mb / 23P
[Old version datasheet]   Ceramic Speaker Driver
LM4962 TI1-LM4962_14 Datasheet
926Kb / 23P
[Old version datasheet]   Ceramic Speaker Driver
logo
National Semiconductor ...
LM4962 NSC-LM4962 Datasheet
1Mb / 22P
   Ceramic Speaker Driver
LM48555 NSC-LM48555 Datasheet
332Kb / 14P
   Ceramic Speaker Driver
logo
Texas Instruments
LM4961 TI1-LM4961 Datasheet
1Mb / 24P
[Old version datasheet]   Ceramic Speaker Driver
LM48556 TI1-LM48556_14 Datasheet
1Mb / 23P
[Old version datasheet]   Fully Differential, Mono, Ceramic Speaker Driver
LM48556 TI1-LM48556 Datasheet
1Mb / 22P
[Old version datasheet]   Fully Differential, Mono, Ceramic Speaker Driver
logo
National Semiconductor ...
LM48556 NSC-LM48556 Datasheet
1Mb / 20P
   Fully Differential, Mono, Ceramic Speaker Driver
logo
Maxim Integrated Produc...
MAX9788 MAXIM-MAX9788_07 Datasheet
299Kb / 16P
   14VP-P,Class G Ceramic Speaker Driver
Rev 1; 11/07
logo
Integrated Silicon Solu...
IS31AP4915-QFLS2-TR ISSI-IS31AP4915-QFLS2-TR Datasheet
322Kb / 10P
   20VP-P CHARGE PUMP CERAMIC SPEAKER DRIVER
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16


데이터시트 다운로드

Go To PDF Page


링크 URL




개인정보취급방침
ALLDATASHEET.CO.KR
ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com