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LM3411-L

SNVSAX5 – JUNE 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

See AN-450 Surface Mounting Methods and Their Effect on Product Reliability (SNOA742) for methods on soldering surface-mount

devices.

(3)

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

20

V

Output current

20

mA

(3)

300

mW

Lead temperature

Vapor phase (60 s)

215

°C

Infrared (15 s)

220

Junction temperature

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±1500

V

(1)

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Input voltage

LM3411x 3.3-V

3.3

V

LM3411x 5-V

5

Output current

0

15

mA

Ambient temperature

–40

85

°C

Operating junction temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC

LM3411-L

UNIT

DBV (SOT-23)

5 PINS

Junction-to-ambient thermal resistance

178.6

°C/W

Junction-to-case (top) thermal resistance

134.7

°C/W

Junction-to-board thermal resistance

37.3

°C/W

Junction-to-top characterization parameter

24.7

°C/W

Junction-to-board characterization parameter

36.8

°C/W

Junction-to-case (bottom) thermal resistance

—

°C/W