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8 / 12 page CS8182 http://onsemi.com 8 Figure 18. 8 Lead SOIC (Fused) Thermal Resistance Figure 19. 5 Lead DPAK Thermal Resistance COPPER AREA (mm2) COPPER AREA (mm2) 700 600 500 400 300 200 100 0 0 20 40 60 80 100 160 180 700 600 500 400 300 200 100 0 0 20 40 60 80 100 160 180 120 140 800 1 oz 2 oz 800 1 oz 2 oz 120 140 Figure 20. 5 Lead D2PAK Thermal Resistance Figure 21. Thermal Resistance Summary COPPER AREA (mm2) COPPER AREA (mm2) 700 600 500 400 300 200 100 0 0 20 40 60 80 100 160 180 700 600 500 400 300 200 100 0 0 20 40 60 80 100 160 180 120 140 800 1 oz 2 oz 800 120 140 8 Lead SOIC w/ 4 Thermal Leads 1 oz 8 Lead SOIC w/ 4 Thermal Leads 2 oz 5 Lead DPAK 1 oz 5 Lead DPAK 2 oz 5 Lead D2PAK 2 oz 5 Lead D2PAK 1 oz |
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