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SN74AUP1G79 데이터시트(PDF) 5 Page - Texas Instruments |
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SN74AUP1G79 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 45 page 5 SN74AUP1G79 www.ti.com SCES592I – JULY 2004 – REVISED SEPTEMBER 2017 Product Folder Links: SN74AUP1G79 Submit Documentation Feedback Copyright © 2004–2017, Texas Instruments Incorporated (1) All unused inputs of the device must be held at VCC or GND to assure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs. 6.3 Recommended Operating Conditions MIN MAX UNIT VCC Supply voltage 0.8 3.6 V VIH High-level input voltage VCC = 0.8 V VCC V VCC = 1.1 V to 1.95 V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.6 VCC = 3 V to 3.6 V 2 VIL Low-level input voltage VCC = 0.8 V 0 V VCC = 1.1 V to 1.95 V 0.35 × VCC VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.9 VI Input voltage(1) 0 3.6 V VO Output voltage 0 VCC V IOH High-level output current VCC = 0.8 V –20 µA VCC = 1.1 V –1.1 mA VCC = 1.4 V –1.7 VCC = 1.65 V –1.9 VCC = 2.3 V –3.1 VCC = 3 V –4 IOL Low-level output current VCC = 0.8 V 20 µA VCC = 1.1 V 1.1 mA VCC = 1.4 V 1.7 VCC = 1.65 V 1.9 VCC = 2.3 V 3.1 VCC = 3 V 4 Δt/Δv Input transition rise or fall rate VCC = 0.8 V to 3.6 V 200 ns/V TA Operating free-air temperature –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) SN74AUP1G79 UNIT DBV (SOT-23) DCK (SC70) DRL (SOT-5X3) DRY (SON) DSF (SON) DPW (X2SON) YFP (DSBGA) YZP (DSBGA) 5 PINS 5 PINS 5 PINS 6 PINS 6 PINS 5 PINS 6 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 267.2 284.1 294.1 341.1 377.1 489.2 125.4 146.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 191.9 208.5 132.5 233.1 187.7 226.3 1.9 1.4 °C/W RθJB Junction-to-board thermal resistance 101.1 103.1 143.4 206.7 236.6 352.9 37.2 39.3 °C/W ψJT Junction-to-top characterization parameter 83.0 76.6 14.5 63.4 29.0 38.2 0.5 0.7 °C/W ψJB Junction-to-board characterization parameter 100.8 102.3 143.9 206.7 236.3 352.1 37.5 39.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A 150.8 N/A N/A °C/W |
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