전자부품 데이터시트 검색엔진 |
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GO1515 데이터시트(PDF) 3 Page - Gennum Corporation |
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GO1515 데이터시트(HTML) 3 Page - Gennum Corporation |
3 / 4 page 522 - 40 - 02 3 Fig. 1 Footprint of the GO1515 DIMENSIONS SOLDERING RECOMMENDATIONS Reflow Conditions The device will meet the data sheet specifications after completing the reflow process according to the profile shown in Figure 3. Do not reflow the device more than twice. Endurance To Warp When the device is soldered on a printed circuit board (dimension: 100mm x 100mm; thickness: 1.6mm) and the PCB is warped as shown in Figure 2, the device will not be cracked or damaged. Fig. 3 PCB Warp Soldering Conditions Recommended soldering conditions are as follows: Reflow Soldering Preheating 150±10°C, 60 to 120 sec. Soldering Peak 230±5°C Over 200°C within 30 sec. Soldering Flux Do not use cleaning type flux. Washing the devices after using cleaning type flux may damage inner parts and affect performance. Solder Type Use solder H60, H63 (in JIS Z 3282) or an equivalent type. This also applies to solder paste. OUT NC GND VCC VCTR GND 65 55 40 40 55 65 45 GND GND GO1515 TOP VIEW All dimensions are in mils 1 mil = 1/1000 inch GO1515 TOP VIEW 2.0 ±0.3 4.2 ±0.3 6.0 MAX 1.6±0.5 4.7±0.3 6.3±0.3 7.8 MAX All dimensions in millimetres. NC GND OUT VCC VCTR GND GND GND 2.0 MAX VCO PCB MAX 2mm |
유사한 부품 번호 - GO1515 |
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유사한 설명 - GO1515 |
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